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Reference Books

Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces: High Performance Compute and System-in-Package

Published on December 7th, 2021

The book and the ebook "Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces: High Performance Compute and System-in-Package" can be ordered from Amazon using the following links:

» amazon.de
» amazon.com


Advances in Embedded and Fan-Out Wafer Level Packaging Technologies order by amazon

Published on February 20th, 2019

The book and the ebook "Advances in Embedded and Fan-Out Wafer Level Packaging Technologies" can be ordered from Amazon using the following links:

» amazon.de
» amazon.com

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