European Project "EUROPAT-MASIP" - Reinforcing the European semiconductor industry
The European Packaging, Assembly and Test Pilot for Manufacturing of Advanced System-In-Package (EuroPAT-MASIP) project will reinforce the European semiconductor manufacturing position through focusing in the Integrated Circuit and MEMS packaging ecosystem. The goal of the project is to accelerate the manufacturing uptake of advanced packaging technologies and shorten time-to-market by demonstrating the new capabilities in need-based Application Pilots.
Some facts and figures:
This Joint Undertaking received support from the European Union's Horizon 2020 research and innovation programme,
Electronic Component Systems for European Leadership Joint Undertaking (ECSEL-JU), Grant agreement No 737497,
31 project partners from 9 Eurepean countries (Portugal, Austria, Netherlands, Finland, Germany, Hungary, Ireland, France, and Sweden),
Overall budget 30 Mio€, European and national funding 12.5 Mio€,
Project Initiator and first Project Coordinator: Steffen Kroehnert,
Current Project Coordinator. Feleandorio Fernandes, Amkor Technology Portugal (ATEP).