Service Offer

European Semiconductor Packaging, Assembly and Test (ESPAT) offers consultancy and services for:

• Packaging Technology decision-making for new applications/products (Start-ups, SME);
• Package Design, Bill of Material (BOM) and Process of Record (POR) support;
• Supply Chain setup for prototypes, samples, small-medium-high volume manufacturing;
• Technology Promotion for innovative SPAT technology development companies;
• Strategic Guidance provision to SPAT equipment and material suppliers on what's next;
• Technology Trend analysis for Market Studies and Technology Reports;
• Market Researchers and Trend Scouting support;
• Research Institutes cooperation on national and European project acquisition;
• Active Representation of European SPAT in relevant international industry associations:
  • SEMI Europe - APC Chair @ SEMICON Europa, Founder & Vice Chair of ESiPAT-TC;
  • IEEE Electronics Packaging Society (EPS) - Elected to BoG 2021-2023 for Region 8 (EMEA);
  • IMAPS (Europe, US) - Conference Program Committee Member, and SMTA.